產品優勢:
1、擁有隔膜張力控制及糾偏算法多項技術。2、極片放卷采用整體糾偏,取消過程糾偏。
3、在線實時檢測疊片OH,并閉環檢測的OH值,提升電芯OH CPK。
4、效率和成本優勢。同一套單面模具模切出上、下單面。
5、設備具有25FFU高效過濾器和除塵系統,設備自清潔程度高。
6、整機布局疊臺多工位,維護便捷、各疊臺可相互獨立運行。

1. The tin balls are melted by laser, and the melted tin balls are sprayed onto the welding parts
to achieve precise welding, thereby ensuring the reliable electrical continuity and welding
strength of the components;
2. Non-contact welding, no flux welding, no cleaning;
2. Non-contact welding, no flux welding, no cleaning;
1. Flux-free soldering, no cleaning, cost saving;
2. Solder ball soldering, stable tin
amount of solder joints, good appearance consistency, improve soldering quality;
3. Realize
precise soldering of tiny soldering positions, solving the problem of manual inability to solder
;
4. High welding speed, increase productivity and save labor costs;
The product is suitable for BGA, VCM, CCM, HDD
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
| Basic Parameters | Dimensions (mm) | 1310(L)*1150(W)*1800(H) mm |
| Equipment weight | 1600kg | |
| Operating voltage | 220VAC, 50/60Hz | |
| Normal power | 16KW | |
| Working air pressure | 0.4~0.6 Mpa | |
| Working nitrogen pressure | 0.2~0.4 Mpa | |
| Function Parameter | Applicable solder ball diameter specification (um) | 70-1000 |
| Welding speed (ball/sec) | 4~8 | |
| Applicable welding spacing | 0.1mm minimum | |
| Mean time between failures (MTBF) | 4H | |
| Equipment one-time optimization rate | ≥99.5% | |
| Repeatability | ≤0.003mm | |
| Welding accuracy | ±0.01mm | |
| Environmental Parameters | Noise | <70dB |
| Temperature | 10~40℃ | |
| Humidity | 40~70% |
中文
EN






